|
Project/Item |
Processing Capacity |
|
|
Layers |
1-48Layers |
|
|
Max Machining/Production Size |
630x730mm |
|
|
Product Board Thickness |
0.3-6mm |
|
|
Copper foil thickness of conductor |
1/3-120Z |
|
|
Min Line Width/Space |
0.075/0.075mm（3mil/3mil）- |
|
|
Min Aperture |
0.15mm（6mil） |
|
|
Through hole single side welding ring |
0.1mm（4mil） |
|
|
Impedance Control |
±5% |
|
|
Profile Machining Accuracy |
±0.01mm（4mil） |
|
|
Board Type/available laminates materail |
CEM-3、FR4 （High Tg，Halogen Free） ,Rogers,Teflon,Arlon, Metal Base(Aluminum,Copper), Mixematerial | |
|
Surface Treatment |
HASL、Nickel gold plating、ENIG、Immersion Silver、Immersion Tin、OSP、Immersion gold +OSP、Nickel gold plating + HASL |
|
|
Other |
Manufacturing capacity of Shenzhen factory：2-16Layers、Thick copper plate、Copper thickness 1-9OZ、Plate thickness 0.6-5.0mm |
|
|
Capacity |
2.48 million square feet / month 2L-20%、4L-40%、6L and above40% |
|
|
Sample |
Double side 3-4Days；Multilayer 6-7days |
|
|
Staus/time/product |
Double side |
Multilayer |
|
New order |
7-8days |
9-12days |
|
Repeat order |
6-7days |
8-12days |
